发明名称 ベアチップ実装面発光体の製造方法及びベアチップ実装面発光体
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a surface light emitter constituting a guide display board or the like, which can continuously perform mounting a bare chip on a substrate through printing on the surface light emitter in series. <P>SOLUTION: This manufacturing method includes: connecting a blue bare chip 3B onto a wiring pattern 20 on a resin substrate 1 and also bonding an electrode of the bare chip 3B to a plated layer; subsequently, heating the resin substrate 1 having been manufactured by the above process by using a heating means H; also heating a coating material 8 which is to be dripped on the resin substrate 1; and dripping the heated coating material 8 by branching it in strips so as to correspond with a width of the resin substrate 1 by using an injection means PO. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5931330(B2) 申请公布日期 2016.06.08
申请号 JP20100237735 申请日期 2010.10.22
申请人 不二サッシ株式会社;二宮 宏;サティスボンバー株式会社 发明人 二宮 宏
分类号 H01L33/48;H01L23/12;H01L23/28 主分类号 H01L33/48
代理机构 代理人
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