| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imprint device advantageous to overlapping of a pattern present on a substrate in advance and a resin pattern newly formed on the substrate when imprint processing is performed. <P>SOLUTION: An imprint device 1 comprises: a substrate heating mechanism 6; and a controller 7. The substrate heating mechanism 6 includes an optical element 21 for light-receiving light 9 having a first wavelength and a second wavelength present in a specific wavelength band, other than the first wavelength, and dividing the light 9 into light having a first wavelength and light having a second wavelength, and heating a substrate-side pattern 20 present in advance in a region on a substrate 10 on which a pattern is to be formed. When the pattern is formed, the controller 7 allows the substrate heating mechanism 6 to thermally deform the substrate-side pattern 20 by using the light having the second wavelength separated by the optical element 21 to correct a shape of the substrate-side pattern 20 with respect to a shape of a pattern portion 8a formed on a mold 8. Here, a resin 14 is a photocurable resin which is cured by receiving the light having the first wavelength present in the specific wavelength band. <P>COPYRIGHT: (C)2013,JPO&INPIT |
