USE OF A LAMINATE BODY, LAMINATE BOARD OR MULTI-LAYER LAMINATE PLATE FOR MAKING A PRINTED WIRING BOARD, THE PRINTED WIRING BOARD AND PRODUCTION METHOD FOR LAMINATE PLATE

摘要

The present invention provides a use for producing a printed wiring board of a laminate body, a laminate plate or a multilayer laminate plate, a printed wiring board and a method for producing a laminate plate. The laminate body and the laminate plate each contain at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler, wherein the content of the inorganic filler in the resin composition is from 5 to 75% by volume of the resin composition. In the laminate plate, the resin composition layer is a cured resin layer. The multilayer laminate plate contains multiple laminate plates, wherein at least one laminate plate is the above-mentioned laminate plate.