| 摘要 |
Providing the conductive paste for the material forming the conductive connecting member without disproportionately located holes (gaps), coarse voids, and cracks, which improves thermal cycle and is excellent in crack resistance and bonding strength. An conductive paste including metal fine particles (P) comprising metal fine particles (P1) of one or more than two kinds selected from metal and alloy thereof, having mean primary particle diameter from 1 to 150nm, and metal fine particles (P2) of same metal as the metal fine particles (P1), having mean primary particle diameter from 1 to 10 µm, mixing ratio of (P1/P2) being from 80 to 95 mass% for P1 and from 20 to 5 mass% for P2 (a total of mass% being 100 mass%); and organic dispersion medium (D) comprising organic solvent (S), or organic solvent (S) and organic binder (B), mixing ratio (P/D) of the metal fine particles (P) and the organic dispersion medium (D) being from 50 to 85 mass% for P and from 50 to 15 mass% for D (a total of mass% being 100 mass%). |
