发明名称 |
THERMALLY CONDUCTIVE DIELECTRIC FOR THERMOFORMABLE CIRCUITS |
摘要 |
This invention is directed to a polymer thick film thermally conductive thermoformable dielectric composition comprising urethane resin, thermoplastic phenoxy resin, diacetone alcohol and thermally conductive powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process. |
申请公布号 |
EP3027686(A1) |
申请公布日期 |
2016.06.08 |
申请号 |
EP20140750290 |
申请日期 |
2014.07.30 |
申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
ARANCIO, VINCENZO;DORFMAN, JAY ROBERT |
分类号 |
C08L75/04;H03K17/96 |
主分类号 |
C08L75/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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