| 发明名称 |
Semiconductor Devices, Multi-Die Packages, and Methods of Manufacture Thereof |
| 摘要 |
Semiconductor device, multi-die packages, and methods of manufacture thereof are described. In an embodiment, a semiconductor device may include: first conductive pillars and second conductive pillars respectively aligned to a first row of first pins and a second row of second pins of a first die, the first pins and the second pins differing in function; a first insulating layer covering surfaces of the first conductive pillars and the second conductive pillars facing away from the first die; first pads disposed on a surface of the first insulating layer facing away from the first die, the first pads substantially aligned to the first conductive pillars; and first traces coupled to the first pads, the first traces extending over a portion of the first insulating layer covering the second conductive pillars. |
| 申请公布号 |
US2016155730(A1) |
申请公布日期 |
2016.06.02 |
| 申请号 |
US201514671824 |
申请日期 |
2015.03.27 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Chen Hsien-Wei;Su An-Jhih;Wu Chi-Hsi;Yeh Der-Chyang;Tai Shih-Peng |
| 分类号 |
H01L25/18;H01L21/56;H01L21/311;H01L23/528;H01L21/02;H01L23/522;H01L23/535;H01L23/50;H01L25/00;H01L21/768 |
主分类号 |
H01L25/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
first conductive pillars and second conductive pillars respectively aligned to a first row of first pins and a second row of second pins of a first die, the first pins and the second pins differing in function; a first insulating layer covering surfaces of the first conductive pillars and the second conductive pillars facing away from the first die; first pads disposed on a surface of the first insulating layer facing away from the first die, the first pads substantially aligned to the first conductive pillars; and first traces coupled to the first pads, the first traces extending over one or more of the second conductive pillars. |
| 地址 |
Hsin-Chu TW |
