SYSTEM FOR INTEGRATING PRECEDING STEPS AND SUBSEQUENT STEPS

摘要

Provided is a semiconductor manufacturing system in which a series of steps, from the manufacturing of semiconductors on wafers to packaging, can be easily linked. The present invention comprises a semiconductor chip manufacturing device 3 for manufacturing semiconductor chips, and a semiconductor packaging device 5 that packages the semiconductor chips by attaching the semiconductor chips to package substrates which are larger than the wafers. The semiconductor chip manufacturing device 3 has a pulsed plasma doping PLAD system 9 for loading the wafers into and out of the semiconductor manufacturing device 3 via a shuttle 7 which is capable of housing the wafers. The semiconductor packaging device 5 has a PLAD system 9 for making it possible to load the package substrates into and out of the semiconductor packaging device 5 via a shuttle 8 which is capable of housing the package substrates. The shuttles 7, 8 have container bodies of the same shape.