METHOD OF MANUFACTURING PLATE-LIKE MEMBER WITH BUMP ELECTRODE, PLATE-LIKE MEMBER WITH BUMP ELECTRODE, METHOD OF MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a plate-like member with a bump electrode, which enables simple and efficient manufacture of an electronic component having both a via electrode (the bump electrode) and the plate-like member.SOLUTION: A method of manufacturing a plate-like member with a bump electrode is a method of manufacturing a member for an electronic component having a chip sealed with a resin. The member is the plate-like member 10 with the bump electrode, which has the bump electrode 12 fixed on the one side of the plate-like member 10. The method of manufacturing the plate-like member with the bump electrode includes a molding step of concurrently molding the plate-like member 10 and the bump electrode 11 by molding using a molding tool.SELECTED DRAWING: Figure 5