发明名称 WIRELESS COMMUNICATIONS MODULE
摘要 A wireless communications module, including a module substrate, wherein a plurality of elements, a ground pattern, and a conduction pattern are disposed on a surface of the module substrate. A shield integrated antenna is disposed on the surface of the module substrate, wherein the shield integrated antenna includes a shield part enclosing at least one element of the plurality of elements; a ground part extending from a side surface of the shield part and electrically connected to the ground pattern; and an antenna part extending from the ground part and electrically connected to the conduction pattern.
申请公布号 US2016156098(A1) 申请公布日期 2016.06.02
申请号 US201514947264 申请日期 2015.11.20
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM Hyo Jin
分类号 H01Q1/52;H01Q1/48 主分类号 H01Q1/52
代理机构 代理人
主权项 1. A wireless communications module, comprising: a module substrate, wherein a plurality of elements, a ground pattern, and a conduction pattern are disposed on a surface of the module substrate; and a shield integrated antenna disposed on the surface of the module substrate, wherein the shield integrated antenna comprises: a shield part enclosing one element of the plurality of elements; a ground part extending from a side surface of the shield part and electrically connected to the ground pattern; and an antenna part extending from the ground part and electrically connected to the conduction pattern.
地址 Suwon-Si KR
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