发明名称 |
WIRELESS COMMUNICATIONS MODULE |
摘要 |
A wireless communications module, including a module substrate, wherein a plurality of elements, a ground pattern, and a conduction pattern are disposed on a surface of the module substrate. A shield integrated antenna is disposed on the surface of the module substrate, wherein the shield integrated antenna includes a shield part enclosing at least one element of the plurality of elements; a ground part extending from a side surface of the shield part and electrically connected to the ground pattern; and an antenna part extending from the ground part and electrically connected to the conduction pattern. |
申请公布号 |
US2016156098(A1) |
申请公布日期 |
2016.06.02 |
申请号 |
US201514947264 |
申请日期 |
2015.11.20 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM Hyo Jin |
分类号 |
H01Q1/52;H01Q1/48 |
主分类号 |
H01Q1/52 |
代理机构 |
|
代理人 |
|
主权项 |
1. A wireless communications module, comprising:
a module substrate, wherein a plurality of elements, a ground pattern, and a conduction pattern are disposed on a surface of the module substrate; and a shield integrated antenna disposed on the surface of the module substrate, wherein the shield integrated antenna comprises: a shield part enclosing one element of the plurality of elements; a ground part extending from a side surface of the shield part and electrically connected to the ground pattern; and an antenna part extending from the ground part and electrically connected to the conduction pattern. |
地址 |
Suwon-Si KR |