| 发明名称 |
SENSOR DEVICE AND ELECTRONIC APPARATUS |
| 摘要 |
A sensor device and an electronic apparatus by which downsizing and a reduction in costs can be achieved is provided. A sensor device according to an embodiment of the present technology includes a sensor element and a semiconductor element. The semiconductor element includes a first surface, a second surface, and a via-hole. The first surface includes a first terminal on which the sensor element is mounted and is an inactive surface. The second surface includes a second terminal for external connection and is an active surface. The via-hole electrically connects the first surface and the second surface to each other. |
| 申请公布号 |
US2016155927(A1) |
申请公布日期 |
2016.06.02 |
| 申请号 |
US201414785903 |
申请日期 |
2014.03.20 |
| 申请人 |
SONY CORPORATION |
发明人 |
KABASAWA Hidetoshi;OZAKI Hiroshi;TAKAHASHI Kazuo;MITANI Satoshi |
| 分类号 |
H01L41/113;H01L41/047;H01L41/053;G01C19/5769 |
主分类号 |
H01L41/113 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sensor device, comprising:
a sensor element; and a semiconductor element including
a first surface that includes a first terminal on which the sensor element is mounted and is an inactive surface,a second surface that includes a second terminal for external connection and is an active surface, anda via-hole that electrically connects the first surface and the second surface to each other. |
| 地址 |
Tokyo JP |
