| 摘要 |
The invention relates to an electronics module (1) which can be used in particular for a transmission control unit for a motor vehicle. The electronics module (1) comprises a carrier plate (5), a circuit board (3) having conducting paths arranged thereon, and at least one electronic component (7, 11). The electronics module (1) is characterised in that at least sub-regions (9, 13) of the electronic component (7, 11) are accommodated between the carrier plate (5) and the circuit board (3), in such a way that the electronic component (7, 11) is secured by a form-fit in a transverse direction in relation to the carrier plate (5). The electronic component (7, 11) is thus electrically connected via press contacts (23) to conducting paths of the circuit board (3), and regions of conducting paths of the circuit board (3) adjacent to one of the press contacts (23) are covered by a hardened layer (33) that can be processed as a fluid, such as, for example, an adhesive or lacquer. The proposed concept permits an electronics module to be produced without soldering or welding processes, via which both production costs and production complexity can be reduced, and a reliability of the electronics module can be improved. |
