METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

摘要

The present invention suggests a method for stacking a board of an ultra-high multi-layer by combining a pin alignment method and an alignment bonding method. In the method according to the present invention, primarily, a tack welding of each layer is performed with a high frequency bonding method after aligning each layer by recognizing an alignment mark made in each layer through a CCD camera. Secondly, the tack welded layers are aligned to make a pin of a laminate penetrate through a pin hole previously formed in each layer, and are hot-pressed at high temperature and high pressure, thereby completing a laminating process.