发明名称 LIGHT EMITTING DEVICE PACKAGE
摘要 An embodiment relates to a light-emitting device package. In an embodiment, the light-emitting device package includes a package body configured to include a top surface, a plate guide unit disposed on the top surface, and a cavity formed in the top surface, a light-emitting device disposed within the cavity, a plate disposed on the top surface of the package body and guided by the plate guide unit, and an adhesive member disposed between the top surface of the package body and the plate. The adhesive member includes a base layer made of a flexible material, a first adhesive tape disposed between the base layer and the top surface of the package body and bonded to the base layer and the top surface of the package body, and a second adhesive tape disposed between the base layer and the plate and bonded to the base layer and the plate.
申请公布号 US2016155907(A1) 申请公布日期 2016.06.02
申请号 US201514953254 申请日期 2015.11.27
申请人 LG Innotek Co., Ltd. 发明人 OZEKI Satoshi;TANDA Yuichiro
分类号 H01L33/48;H01L33/62;H01L33/60 主分类号 H01L33/48
代理机构 代理人
主权项 1. A light-emitting device package, comprising: a package body configured to comprise a top surface, a plate guide unit disposed on the top surface, and a cavity formed in the top surface; a light-emitting device disposed within the cavity; a plate disposed on the top surface of the package body and guided by the plate guide unit; and an adhesive member disposed between the top surface of the package body and the plate, wherein the adhesive member comprises: a base layer made of a flexible material;a first adhesive tape disposed between the base layer and the top surface of the package body and bonded to the base layer and the top surface of the package body; anda second adhesive tape disposed between the base layer and the plate and bonded to the base layer and the plate.
地址 Seoul KR