| 发明名称 |
MEMORY DEVICE, MEMORY MODULE INCLUDING THE MEMORY DEVICE, METHOD OF FABRICATING THE MEMORY MODULE, AND METHOD OF REPAIRING THE MEMORY MODULE |
| 摘要 |
A memory module is provided. A plurality of DRAMs is mounted on a PCB. At least one DRAM has an operating parameter different from other DRAMs according to a position where the at least one DRAM is mounted on the PCB. |
| 申请公布号 |
US2016155487(A1) |
申请公布日期 |
2016.06.02 |
| 申请号 |
US201615015754 |
申请日期 |
2016.02.04 |
| 申请人 |
KANG DAN-KYU;KANG SANG-SEOK;AHN YOUNG-MAN |
发明人 |
KANG DAN-KYU;KANG SANG-SEOK;AHN YOUNG-MAN |
| 分类号 |
G11C11/406;G11C11/4076;G11C17/16;G11C11/4093 |
主分类号 |
G11C11/406 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A memory module, comprising:
a PCB; and a plurality of DRAMs mounted on the PCB, wherein at least one DRAM has an operating parameter different from other DRAMs according to a position where the at least one DRAM is mounted on the PCB. |
| 地址 |
ANYANG-SI KR |
