ELECTRONIC COMPONENT HOUSING PACKAGE, MULTI-PIECE WIRING BOARD, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT HOUSING PACKAGE

摘要

The electronic component housing package according to the present invention is provided with: an insulating board (101) having an upper surface including an electronic component (103) mounting portion (102); a frame-like metallized layer (106) formed on the upper surface of the insulating board (101) and enclosing the mounting portion (102); and a metal frame body (108) joined onto the frame-like metallized layer (106) by means of brazing material (107). The frame-like metallized layer (106) includes a first inclined portion (106a) which is inclined inward from the upper surface toward the inner peripheral side surface. A fillet (107a) comprising the brazing material (107) is formed between the outer periphery of the upper surface of the frame-like metallized layer (106) and the metal frame body (108), and a filling portion (107b) comprising the brazing material (107) is formed between the first inclined portion (106a) and the metal frame body (108).