| 摘要 |
[Problem] To improve productivity. [Solution] A substrate processing method of one embodiment of the present invention comprises a removal step, a cleaning step, and a processing fluid supply step. In the removal step, a hardened or cured first processing fluid is removed from a substrate on which a film has been formed as a result of the hardening or curing of the first processing fluid caused by volatilization of a volatile component. In the cleaning step, the substrate is cleaned after the removal step. In the processing fluid supply step, a second processing fluid that hardens or cures due to volatilization of a volatile component is supplied to the substrate after the cleaning step. |
