RESIN BURR REMOVAL DEVICE AND RESIN ENCAPSULATION TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin encapsulation type semiconductor device whose mold mating surface includes a vertical area as well as one horizontal surface capable of removing a resin burr perpendicular to a mold mating surface generated during molding.SOLUTION: The resin burr removing device for removing a resin burr generated along a surface of a mold mating surface in a vertical direction of a mold of resin encapsulation type semiconductor device having a mold mating surface of an uneven shape having steps in the vertical direction includes a resin burr removal part having a scraper for removing the resin burr by moving to a position where the burr is formed along a surface parallel to a horizontal surface out of the mold mating surfaces.SELECTED DRAWING: Figure 9