| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when etching a metal film on a piezoelectric substrate, since a flow of an etchant becomes different, regions at different etching rates are present and if the metal film on the piezoelectric substrate is etched in the regions with the different etching rates, the metal film is not etched uniformly.SOLUTION: The regions at the different etching rates are identified, the etching rates in the different regions are calculated, a resist pattern shape is determined based on the calculated etching rates and the metal film on the piezoelectric substrate is etched, such that the metal film on the piezoelectric substrate is etched uniformly.SELECTED DRAWING: Figure 6 |
