发明名称 ABRASIVE PAD
摘要 PROBLEM TO BE SOLVED: To provide an abrasive pad capable of sufficiently supplying a polishing slurry to a part required for polishing, and capable of reducing the quantity of the polishing slurry to be used.SOLUTION: The abrasive pad comprises a polishing layer of which the surface is supplied with the polishing slurry and which is capable of polishing an object to be polished while being rotated. The polishing layer includes a linear groove on the surface. The groove includes: a first groove that extends from a central part of the surface to a side of an edge of the polishing layer; and a second groove that is connected with an end of the first groove at the side of the edge and curved so as not to be in contact with the edge, and includes an annular path that is not opened at the edge.SELECTED DRAWING: Figure 1
申请公布号 JP2016103600(A) 申请公布日期 2016.06.02
申请号 JP20140242185 申请日期 2014.11.28
申请人 NITTA HAAS INC 发明人 MORIOKA YOSHITAKA;OBARA MOTOYUKI
分类号 H01L21/304;B24B37/26 主分类号 H01L21/304
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