发明名称 HEAT DISSIPATION STRUCTURE OF INTELLIGENT WEARABLE DEVICE
摘要 A heat dissipation structure of intelligent wearable device includes a wearable mobile device main body and a hard wearable body. The wearable mobile device main body has a receiving space for receiving therein multiple electronic components. The electronic components have at least one heat source. The hard wearable body is made of thermosetting polymer material or thermoplastic polymer material. The hard wearable body has a chamber having a capillary structure. A working fluid is contained in the chamber. The hard wearable body has a heat absorption section and a heat dissipation section. The hard wearable body is connected with the wearable mobile device main body. The heat absorption section is in contact with the electronic components or the heat source to conduct heat to the heat dissipation section to dissipate the heat at a remote end. Accordingly, the heat dissipation efficiency of the intelligent wearable device is greatly enhanced.
申请公布号 US2016154442(A1) 申请公布日期 2016.06.02
申请号 US201414555708 申请日期 2014.11.28
申请人 Asia Vital Components Co., Ltd. 发明人 Shen Ching-Hang
分类号 G06F1/20;G06F1/16 主分类号 G06F1/20
代理机构 代理人
主权项 1. A heat dissipation structure of intelligent wearable device, comprising: a wearable mobile device main body having a receiving space for receiving therein multiple electronic components, the electronic components having at least one heat source; and a hard wearable body made of thermosetting polymer material or thermoplastic polymer material, the hard wearable body having a chamber having a capillary structure, a working fluid being contained in the chamber, the hard wearable body having a heat absorption section and at least one heat dissipation section, the heat dissipation section extending from at least one end of the heat absorption section or two ends of the heat absorption section, the hard wearable body being connected with the wearable mobile device main body, the heat absorption section being in contact with the electronic components or the heat source to conduct heat.
地址 New Taipei City TW