LAYING DIE, LAYING DEVICE AND METHOD FOR MANUFACTURING A LAYING DIE

摘要

A laying die, for picking up and laying of substrates, comprising an elastically deformable substrate receiving structure providing an engagement surface for releasable receiving of substrates, an attaching element comprising a gas channel for providing positively or negatively pressurized gas for picking up and blowing off the substrates, and a carrier body made from elastically deformable material and sandwiched between the substrate receiving structure and the attaching element which is arranged to distribute the positively or negatively pressurized gas over the carrier body. The carrier body comprises breakthroughs to transfer the pressurized gas from the attaching element to the substrate receiving structure that comprises an elastically deformable distribution plate to distribute the positively or negatively pressurized gas over the engagement surface. Also, a laying device which changes the position and/or orientation of substrates to predetermined values can comprise the laying die and a method for manufacturing the laying die.

主权项

1. A laying die for picking up and laying of substrates, the laying die comprising
an elastically deformable substrate receiving structure configured to provide an engagement surface to releasably receive substrates; an attaching element comprising a gas channel configured to provide positively or negatively pressurized gas to pick up and blow off the substrates; a carrier body made from an elastically deformable material, the carrier body being sandwiched between the substrate receiving structure and the attaching element, the attaching element being arranged to distribute the positively or negatively pressurized gas over the carrier body, and the carrier body comprising a plurality of breakthroughs to transfer the positively or negatively pressurized gas from the attaching element to the substrate receiving structure, and the substrate receiving structure comprising an elastically deformable distribution plate to distribute the positively or negatively pressurized gas over the engagement surface of the substrate receiving structure.