| 摘要 |
This semiconductor device is provided with: a plurality of main terminals 41, 42, 43 which extend on a base plate 2 from one end of the base plate 2 toward the other end; a high potential-side semiconductor chip group U which is mounted on the base plate 2, and wherein semiconductor chips are arranged side by side on one lateral side of the main terminal 41; and a low potential-side semiconductor chip group L which is mounted on the base plate 2, and wherein semiconductor chips are arranged side by side on the other lateral side of the main terminal 41. The main terminal 41 has a protruded part 41a that extends toward one of the lateral sides of the main terminal 41 in a direction perpendicular to the extending direction of the main terminal 41. Two adjacent semiconductor chips 53, 54 of the low potential-side semiconductor chip group L are arranged to be symmetrical with each other with respect to the protruded part 41a. |
