POLYMER FRAME USED FOR CHIP AND COMPRISING AT LEAST ONE VIA IN SERIES WITH CAPACITOR

摘要

PROBLEM TO BE SOLVED: To provide a chip socket with which passive elements such as capacitors and filters are incorporated within a chip package.SOLUTION: There is provided a chip socket defined by an organic matrix framework. The organic matrix framework comprises at least one via post layer, where at least one via through a frame 1 around a socket 2 includes at least one capacitor 6 comprising a lower electrode, a dielectric layer and an upper electrode in contact with a via post 5.SELECTED DRAWING: Figure 1