PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE IN WHICH A FIRST PORTION OF A SURFACE OF THE SEMICONDUCTOR SUBSTRATE IS RECESSED RELATIVE TO A SECOND PORTION OF THE SURFACE OF THE SEMICONDUCTOR SUBSTRATE TO FORM A RECESSED REGION IN THE SEMICONDUCTOR SUBSTRATE

摘要

Embodiments of the present disclosure provide an apparatus comprising a semiconductor substrate having a first surface, a second surface that is disposed opposite to the first surface, wherein at least a portion of the first surface is recessed to form a recessed region of the semiconductor substrate, and one or more vias formed in the recessed region of the semiconductor substrate to provide an electrical or thermal pathway between the first surface and the second surface of the semiconductor substrate, and a die coupled to the semiconductor substrate, the die being electrically coupled to the one or more vias formed in the recessed region of the semiconductor substrate. Other embodiments may be described and/or claimed.

主权项

1. A method comprising:
providing a semiconductor substrate having (i) a first surface and (ii) a second surface that is disposed opposite to the first surface; recessing at least a portion of the first surface to form a recessed region of the semiconductor substrate; forming one or more vias in the recessed region of the semiconductor substrate to provide a pathway between the first surface and the second surface of the semiconductor substrate, wherein the pathway is at least one of (i) electrically conductive or (ii) thermally conductive; and coupling a die to the semiconductor substrate, wherein the die is electrically coupled to the one or more vias formed in the recessed region of the semiconductor substrate.