发明名称 PHOTO-CURING ANISOTROPIC CONDUCTIVE ADHESIVE MATERIAL, METHOD FOR MANUFACTURING CONNECTION BODY, AND METHOD FOR CONNECTING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a photo-curing anisotropic conductive adhesive material which enables, by using a photo-curing adhesive, the connection of an electronic part at a low temperature in a short time, and the enhancement of fluidity of a binder resin, and the increase in electrical conduction.SOLUTION: A photo-curing anisotropic conductive adhesive material comprises: a conducting adhesive layer 5 including a film formation resin, a photopolymerizable compound, a photoinitiator and conductive particles; and an insulating adhesive layer 6 including a photopolymerizable compound, a photoinitiator, and an optical absorbent. The conducting adhesive layer 5 may further include an optical absorbent by a quantity less than that of the optical absorbent that the insulating adhesive layer 6 includes.SELECTED DRAWING: Figure 2
申请公布号 JP2016103634(A) 申请公布日期 2016.06.02
申请号 JP20150222241 申请日期 2015.11.12
申请人 DEXERIALS CORP 发明人 INASE YOSHIAKI
分类号 H01L21/60;C09J5/00;C09J9/02;C09J163/00 主分类号 H01L21/60
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