发明名称 |
OPTOELECTRONIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF |
摘要 |
An optoelectronic component includes an optoelectronic semiconductor chip embedded in a molded body such that an upper side of the optoelectronic semiconductor chip is at least partially not covered by the molded body, wherein a first metallization is arranged on an upper side of the molded body, wherein the first metallization is electrically insulated from the optoelectronic semiconductor chip, and a first material is arranged on the first metallization. |
申请公布号 |
US2016155891(A1) |
申请公布日期 |
2016.06.02 |
申请号 |
US201414900243 |
申请日期 |
2014.06.25 |
申请人 |
OSRAM Opto Semiconductors GmbH |
发明人 |
Moosburger Jürgen;Stoll Ion;Schwarz Thomas;Richter Markus;Dirscherl Georg |
分类号 |
H01L33/00;H01L33/50;H01L33/60;H01L33/62;H01L27/15;H01L33/54 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Regensburg DE |