| 发明名称 |
ELECTRONIC PACKAGES AND METHODS OF MAKING AND USING THE SAME |
| 摘要 |
An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer and a conformal masking layer disposed on at least a portion of the dielectric layer. The electronic package further includes a routing layer disposed on at least a portion of the masking layer and a micro-via disposed at least in part in the conformal masking layer and the routing layer. Further, at least a portion of the routing layer forms a conformal electrically conductive layer in at least a portion of the micro-via. Also, the conformal masking layer is configured to define a size of the micro-via. The electronic package further includes a semiconductor die operatively coupled to the micro-via. |
| 申请公布号 |
US2016155693(A1) |
申请公布日期 |
2016.06.02 |
| 申请号 |
US201414556258 |
申请日期 |
2014.12.01 |
| 申请人 |
General Electric Company |
发明人 |
Smith Scott;Kapusta Christopher James;Forman Glenn Alan;Davis Eric Patrick |
| 分类号 |
H01L23/498;H01L23/00;H01L21/288;H01L25/065;H01L21/48 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic package, comprising:
A dielectric layer; A conformal masking layer disposed on at least a portion of the dielectric layer; a routing layer disposed on at least a portion of the conformal masking layer; a micro-via disposed at least in part in the conformal masking layer and the routing layer, wherein at least a portion of the routing layer forms a conformal electrically conductive layer in at least a portion of the micro-via, and wherein the conformal masking layer is configured to define a size of the micro-via; and a semiconductor die coupled to the micro-via. |
| 地址 |
Schenectady NY US |
