METHOD FOR MANUFACTURING PILLAR OR HOLE STRUCTURES IN A LAYER OF A SEMICONDUCTOR DEVICE, AND ASSOCIATED SEMICONDUCTOR STRUCTURE

摘要

Method for manufacturing pillar structures in a layer of a semiconductor device, the pillar structures being arranged at positions forming a hexagonal matrix configuration, the method comprising: - embedding alignment pillar structures in a backfill brush polymer layer, the backfill brush polymer layer having a thickness which is about equal to the height of the alignment pillar structures, the alignment pillar structures being at positions corresponding to a subset of the positions of the hexagonal matrix configuration; - providing a BCP layer on a substantially planar surface defined by an upper surface of the alignment pillar structures and the backfill brush polymer layer; - inducing polymer micro phase separation of the BCP polymer layer into pillar structures of a first component of the BCP polymer layer embedded in a second component of the BCP polymer layer, the pillar structures of the first component being arranged at positions forming the hexagonal matrix configuration; and such that on each alignment pillar structure a pillar structure of a first component of the BCP polymer layer is formed; and associated semiconductor structure.