| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which improves insulation performance of a resin sheet between a heat sink and a cooler.SOLUTION: A semiconductor device manufacturing method comprises: a first placement step of placing a thermosetting first resin sheet on a cooler; a second placement step of placing on the first resin sheet, a heat sink and a thermosetting second resin sheet which surrounds the heat sink along a circumference of the heat sink; a thermal curing step of applying pressure to while heating the first resin sheet, the second resin sheet and the heat sink to thermally cure the first resin sheet and the second resin sheet; and a semiconductor element junction step of joining a semiconductor element on the heat sink.SELECTED DRAWING: Figure 1 |
