发明名称 PLATING APPARATUS, PLATING UNIT, AND PLATING LINE
摘要 PROBLEM TO BE SOLVED: To provide a plating apparatus, a plating unit, and a plating line which are capable of coping with various products.SOLUTION: A plating apparatus (3) comprises: a box-shaped plating tank (31) of which the top side is open; an anode part (34) disposed inside the plating tank (31); a cathode part (33) disposed above the plating tank (31); and an oscillation part (32) for oscillating the cathode part (33). In the plating apparatus, a still plating state in which a still plating fixture (8) holding a material to be plated is suspended from the cathode part (33) and a barrel plating state in which a barrel fixture (9) housing the material to be plated is attached to the plating tank (31) can be switched.SELECTED DRAWING: Figure 1
申请公布号 JP2016102223(A) 申请公布日期 2016.06.02
申请号 JP20140239448 申请日期 2014.11.27
申请人 YKK CORP 发明人 HASHIBA KOJI;KIKUKAWA NORIO
分类号 C25D17/00 主分类号 C25D17/00
代理机构 代理人
主权项
地址