| 发明名称 |
ELECTRONIC DEVICE MODULE HAVING A SHIELD LAYER |
| 摘要 |
An electronic device module includes an electronic unit, a sealing layer covering the electronic unit and containing organic molecules, a shield layer covering the sealing layer and containing inorganic elements on an inner surface thereof, and a bonding layer formed between the sealing layer and the shield layer, and containing molecules that are chemically bonded with the organic molecules of the sealing layer and the inorganic elements of the shield layer. |
| 申请公布号 |
US2016157392(A1) |
申请公布日期 |
2016.06.02 |
| 申请号 |
US201514822879 |
申请日期 |
2015.08.10 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HAPPOYA Akihiko |
| 分类号 |
H05K9/00 |
主分类号 |
H05K9/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device module, comprising:
an electronic unit; a sealing layer covering the electronic unit and containing organic molecules; a shield layer covering the sealing layer and containing inorganic elements on an inner surface thereof; and a bonding layer formed between the sealing layer and the shield layer, and containing molecules that are chemically bonded with the organic molecules of the sealing layer and the inorganic elements of the shield layer. |
| 地址 |
Tokyo JP |
