发明名称 |
ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC APPARATUS |
摘要 |
There are provided an electronic component housing package and the like which have high efficiency of heating by infrared rays. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each contain a first material as a major constituent. The electronic component housing package comprises one or more infrared-ray absorbing layers disposed between the plurality of insulating layers and/or disposed on an upper surface of uppermost one of the plurality of insulating layers. The one or more absorbing layers contain a second material which is higher in infrared absorptivity than the first material. |
申请公布号 |
US2016157366(A1) |
申请公布日期 |
2016.06.02 |
申请号 |
US201414900675 |
申请日期 |
2014.08.22 |
申请人 |
KYOCERA CORPORATION |
发明人 |
NIINO Noritaka |
分类号 |
H05K5/00;H05K5/02;H05K5/06 |
主分类号 |
H05K5/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. An electronic component housing package, comprising:
an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section, the plurality of insulating layers each containing a first material as a major constituent; and one or more infrared-ray absorbing layers disposed between the plurality of insulating layers and/or disposed on an upper surface of uppermost one of the plurality of insulating layers, the one or more infrared-ray absorbing layers containing a second material which is higher in infrared absorptivity than the first material. |
地址 |
Kyoto JP |