| 发明名称 |
MULTILAYER CERAMIC SUBSTRATE AND MANUFACTURING THEREOF |
| 摘要 |
A multilayer ceramic substrate includes stacked ceramic layers, and external electrodes including first conductive layers penetrating through one region of an outermost layer of the stacked ceramic layers to thereby be embedded therein, and second and third conductive layers sequentially stacked on the first conductive layers. Each of the first and second conductive layers is formed of a ceramic powder and a metal powder. |
| 申请公布号 |
US2016157341(A1) |
申请公布日期 |
2016.06.02 |
| 申请号 |
US201514887108 |
申请日期 |
2015.10.19 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE Taek Jung;KIM Yong Suk |
| 分类号 |
H05K1/02;H05K1/11;H05K1/09;H01L21/48;H01L23/498;H05K3/46;H05K3/42;H05K1/03;H01L23/495 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multilayer ceramic substrate comprising:
a ceramic layer including a plurality of ceramic sheets stacked on one another; and external electrodes each including a first conductive layer penetrating through one region of an outermost ceramic sheet of the ceramic layer to thereby be embedded therein, and second and third conductive layers sequentially stacked on the first conductive layer, wherein each of the first and second conductive layers is formed of a ceramic powder and a metal powder. |
| 地址 |
Suwon-Si KR |
