发明名称 |
COPPER AND/OR COPPER OXIDE DISPERSION, AND ELECTROCONDUCTIVE FILM FORMED USING DISPERSION |
摘要 |
To provide a copper and/or copper oxide dispersion capable of forming an electroconductive film exhibiting excellent stability with respect to temporal change and having a fine pattern form, an electroconductive film laminate obtained by laminating the electroconductive film produced using the copper and/or copper oxide dispersion, and an electroconductive film transistor. The copper and/or copper oxide dispersion contains 0.50-60 mass % of copper and/or copper oxide microparticies and the following components (1)-(4): (1) a surface energy modifier; (2) an organic compound having a phosphate group; (3) 0.050-10 mass % of a solvent having a vapor pressure of 0.010 Pa to less than 20 Pa at 20° C.; and (4) a solvent having a vapor pressure of 20 Pa to 150 hPa at 20° C. The electroconductive laminate is obtained by laminating an electroconductive film containing copper on a substrate. |
申请公布号 |
US2016155814(A1) |
申请公布日期 |
2016.06.02 |
申请号 |
US201414906422 |
申请日期 |
2014.07.22 |
申请人 |
ASAHI KASEI KABUSHIKI KAISHA |
发明人 |
OGAWA Shimpei;OHNO Eiichi;TSURUTA Masanori |
分类号 |
H01L29/423;H01B1/20;H01L29/417;H01B1/22 |
主分类号 |
H01L29/423 |
代理机构 |
|
代理人 |
|
主权项 |
1. An electroconductive film laminate comprising a copper-containing electroconductive film laminated on a substrate, wherein the area of the electroconductive film laminate has a diameter of 7 inches or greater, calculated as a circle. |
地址 |
Tokyo JP |