| 摘要 |
The invention relates to a dividing method of a brittle substrate, capable of dividing the substrate along a trench line formed by a low load and having no cracks just beneath the trench line. A trench line (TL), extending via one point (N2) on a surface (SF1) of the brittle substrate (11), is formed to maintain a state of no cracks by moving an end portion of a blade. A cross section (SE) having the trench line (TL) exposed is formed to maintain the state of no cracks by dividing the brittle substrate (11) along a line (BL) crossing the trench line (TL) at the one point (N2). Surface roughness of the cross section (SE) is increased. In sequence, the brittle substrate (11) is divided along the trench line (TL). |
