| 摘要 |
PROBLEM TO BE SOLVED: To provide a package substrate capable of resolving drop-off or position deviation of a conductor pattern from a mold body and of facilitating handling at transport or at mounting of a semiconductor element, in the package substrate in which the conductor pattern is buried in and held by the mold body, and to provide a method of manufacturing the same, and a semiconductor device.SOLUTION: A conductor pattern 1 is configured by a lower conductive layer 6 and an upper conductive layer 7. Any one of outer shapes of the lower conductive layer 6 and the upper conductive layer 7 in a plan view is formed larger than the other. On any one of the upper and lower surfaces of the mold body 2, a block layer 11 for preventing the conductor pattern 1 from being dropped off from the mold body 2 is formed. The block layer 11 is formed so as to cover a part of the lower conductive layer 6 or the upper conductive layer 7 exposed from the mold body 2. Due to this, since the conductor pattern 1 is received by the block layer 11 and prevented from being dropped off from the mold body 2, handling of the package substrate can be facilitated.SELECTED DRAWING: Figure 1 |
