SEMICONDUCTOR DESIGN METHOD AND COMPUTER-READABLE RECORDING MEDIUM

摘要

A semiconductor design method is disclosed. Bumps are assigned to multiple Input and Output (I/O) sections of a chip. A plane is formed by deploying vias at locations of the bumps which are allocated to I/O sections of power supplies and grounds, with respect to a package on which the chip is mounted. An allocation of the bumps is changed with respect to the I/O sections of the power supplies and the grounds among the multiple I/O sections based on a number of the vias inside a void formed on the plane.

主权项

1. A semiconductor design method performed in a computer, the method comprising:
assigning, by the computer, bumps to multiple Input and Output (I/O) sections of a chip; arranging, by the computer, a plane by deploying vias at locations of the bumps which are allocated to I/O sections of power supplies and grounds, with respect to a package on which the chip is mounted; and changing, by the computer, an allocation of the bumps with respect to the I/O sections of the power supplies and the grounds among the multiple I/O sections based on a number of the vias inside a void formed on the plane.