| 发明名称 |
TRANSPARENT CONDUCTIVE LAMINATED FILM, METHOD FOR MANUFACTURING SAME, AND TOUCH PANEL |
| 摘要 |
A transparent conductive laminated film, comprising a laminated film comprising a plurality of transparent film substrates and a transparent cured adhesive layer having a storage modulus of 1×107 Pa or more at 140° C., wherein the plurality of transparent film substrates include a first transparent film substrate and a second transparent film substrate and are laminated with the transparent cured adhesive layer interposed between adjacent ones of the film substrates; and, a first transparent conductive layer provided on a surface of the first film substrate opposite to the transparent cured adhesive layer. |
| 申请公布号 |
US2016152002(A1) |
申请公布日期 |
2016.06.02 |
| 申请号 |
US201314392175 |
申请日期 |
2013.10.17 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
Inui Kunihiro;Saito Takeshi;Okamoto Miki;Akizuki Shinsuke |
| 分类号 |
B32B7/12;B32B27/32;B32B37/24;B32B27/08;B32B37/12;B32B27/36;B32B3/26 |
主分类号 |
B32B7/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A transparent conductive laminated film, comprising:
a laminated film comprising a plurality of transparent film substrates and a transparent cured adhesive layer having a storage modulus of 1×107 Pa or more at 140° C., wherein the plurality of transparent film substrates include a first transparent film substrate and a second transparent film substrate and are laminated with the transparent cured adhesive layer interposed between adjacent ones of the film substrates; and a first transparent conductive layer provided on a surface of the first film substrate opposite to the transparent cured adhesive layer. |
| 地址 |
Ibaraki-shi, Osaka JP |
