| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can be thinned.SOLUTION: The wiring board includes an electronic component mounting pad P, an electrode pad E arranged outside the electronic component mounting pad P, a first insulating layer 10 formed on the electronic component mounting pad P and the electrode pad E, an opening 10a formed in the first insulating layer 10 on the electronic component mounting pad P, a connection hole H formed in the first insulating layer 10 on the electrode pad E, and recesses C1 and C2 respectively formed on the electronic component mounting pad P in the opening 10a and the electrode pad E in the connection hole H.SELECTED DRAWING: Figure 13 |
