| 摘要 |
PROBLEM TO BE SOLVED: To provide a cured film particularly excellent in heat resistance and flatness and excellent in adhesion to a base substrate such as glass and transparency, and to provide a composition excellent in coatability giving the cured film.SOLUTION: The photosensitive composition contains a polyester amide acid, a compound having a polymerizable double bond, a photopolymerization initiator, an epoxy compound, and an epoxy curing agent. The polyester amide acid is obtained by reacting a tetracarboxylic acid dianhydride, a diamine, and a polyhydric hydroxy compound as essential raw material components.SELECTED DRAWING: None |
