| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic copper plating solution capable of forming a copper coating that has an excellent plated surface smoothness as well as that does not, with a lapse of time, warp into a concave shape toward the plating surface side.SOLUTION: Provided is an electrolytic copper plating solution for flexible wiring board containing copper sulfate by 60 g/L or more and 120 g/L or less, sulfuric acid by 120 g/L or more and 240 g/L or less, chlorine by 30 mg/L or more and 100 mg/L or less, and an additive. In the additive, a disulfide-based compound by 1 mg/L or more and 50 mg/L or less, a nitrogen-based additive by 0.5 mg/L or more and 30 mg/L or less, a polymer component by 2 g/L or more and 50 g/L or less, and sodium-mercapto propane sulfonic acid by 0.1 mg/L or more and 10 mg/L or less are contained. The copper coating formed by the electrolytic copper plating solution has a uniform smoothness with less convexoconcave as well as has less warpage amount.SELECTED DRAWING: None |
