| 发明名称 |
METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE STRUCTURE |
| 摘要 |
A method of manufacturing a light-emitting package structure is provided. The method includes disposing at least one light emitting element on a carrier and forming a reflective material. The light emitting element has opposite first and second sides and a plurality of third sides connected to the first side and the second side. The light emitting element is disposed on the carrier via the second side. The reflective material is formed on the third side of the light emitting element, so as to form a reflective film. |
| 申请公布号 |
US2016155915(A1) |
申请公布日期 |
2016.06.02 |
| 申请号 |
US201514952165 |
申请日期 |
2015.11.25 |
| 申请人 |
ACHROLUX INC. |
发明人 |
Ling Peiching;Liu Dezhong |
| 分类号 |
H01L33/60;H01L33/62;H01L33/50 |
主分类号 |
H01L33/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a light-emitting package structure, comprising:
disposing on a carrier at least one light emitting element that has opposite first and second sides and a plurality of third sides connected to the first side and the second side, wherein the light emitting element is disposed on the carrier via the second side; and forming on the third side of the light emitting element a reflective material that acts as a reflective film. |
| 地址 |
Sunnyvale CA US |
