| 摘要 |
An encapsulated chip component of a chip card, a sheet-like encapsulation plate for forming thereof, and a forming method, using a sheet-like carrier layer (10) to prepare a plurality of chip modules (20) disposed at intervals, each chip module (20) contains a chip circuit layer pattern (21) formed on a first surface of the sheet-like carrier layer (10) and crystalline grains (22) assembled at an opposing side second surface and able to correspondingly communicate with the chip circuit layer pattern (21); forming at least a plastic encapsulation layer (30) on the second surface of the sheet-like carrier layer (10) and integrating the same; performing monomeric cutting to prepare a plurality of encapsulated chip components (40). Chip module (20) forms a sheet-shaped crystal matrix and can be easily inserted into a slot of a chip card in order to form a chip card; at a manufacturing end, manufacturing processes can be separated, and the chip encapsulation component and the chip card can be mass-produced separately, facilitating the integration thereof, avoiding the drawbacks of using a dedicated machine, and reducing a material cost of the carrier layer, meeting the demands of mass production and improving the economic benefits of smart card technology. |
