METHOD FOR MANUFACTURING STEPPED COPPER COLUMN IN PCB

摘要

A method for manufacturing a stepped copper column (40) in PCB, wherein an electroplating-resistant ink layer (20) is fabricated on a laminate comprising a copper foil layer (11), then a first dry film layer (30) and a first copper plated layer (41) are fabricated on the electroplating-resistant ink layer after baking the electroplating-resistant ink layer at a certain temperature for a certain time, then a second dry film layer (50) and a second copper plated layer (42) are fabricated on it, so that the first dry film layer and the second dry film layer can be removed selectively in a post-process, while the electroplating-resistant ink layer remains good; after continuing electroplating of a tin layer (60) on the laminate, the unwanted copper foil layer is removed by etching, and a PCB with a stepped copper column is obtained.