发明名称 MOLD FIXING DEVICE AND MOLD FIXING METHOD, AS WELL AS EMBOSSING DEVICE AND EMBOSSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a mold fixing device capable of forming an embossed structure of a functional solid material precursor layer with a high accuracy even in a case of adopting a roll-to-sheet method.SOLUTION: There is provided a mold fixing device which relatively fixes a to-be-processed object 10 and a mold M1 by causing a magnetic field generated from a magnetic portion 904 to form a magnetic circuit, starting at one magnetic pole, passing through the mold M1, and ending at the other magnetic pole between each pole of the magnetic portions 904 and the mold M1. The to-be-processed object 10 is sandwiched between a plate-like substrate portion 901 and the mold M1. The substrate portion includes magnetic portions 904 whose magnetic poles are different from each other and which are disposed adjacent to each other with a non-magnetic portion 920 interposed therebetween in plan view. At least a part of the mold M1 is made of a magnetic material to be pressed toward the to-be-processed object 10.SELECTED DRAWING: Figure 4
申请公布号 JP2016101670(A) 申请公布日期 2016.06.02
申请号 JP20140240304 申请日期 2014.11.27
申请人 JAPAN ADVANCED INSTITUTE OF SCIENCE & TECHNOLOGY HOKURIKU;TOSHIBA MACH CO LTD;TOPPAN PRINTING CO LTD 发明人 SHIMODA TATSUYA;FUKADA KAZUHIRO;KOKUBO MITSUNORI;KOYAMA HIROAKI
分类号 B29C33/32;B29C59/02;H01L21/027 主分类号 B29C33/32
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