| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A printed circuit board includes: insulating layers and wiring layers arranged in stacked configuration; a cavity disposed in a first insulating layer among the insulating layers; a piezoelectric substrate disposed in the cavity; an electrode disposed on the piezoelectric substrate and configured to convert an electrical signal into an elastic wave or to convert an elastic wave into an electrical signal; and a sealing part disposed on the piezoelectric substrate, the sealing part enclosing the electrode and forming an air gap around the electrode. |
| 申请公布号 |
US2016156333(A1) |
申请公布日期 |
2016.06.02 |
| 申请号 |
US201514954284 |
申请日期 |
2015.11.30 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
HWANG Mi Ran;KIM Se Jong |
| 分类号 |
H03H9/25;H03H9/10;H01L41/31;H03H9/02;H01L41/047;H01L41/053 |
主分类号 |
H03H9/25 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
insulating layers and wiring layers arranged in stacked configuration; a cavity disposed in a first insulating layer among the insulating layers; a piezoelectric substrate disposed in the cavity; an electrode disposed on the piezoelectric substrate and configured to convert an electrical signal into an elastic wave or to convert an elastic wave into an electrical signal; and a sealing part disposed on the piezoelectric substrate, the sealing part enclosing the electrode and forming an air gap around the electrode. |
| 地址 |
Suwon-si KR |
