发明名称 SEMICONDUCTOR COMPONENT WITH FIELD ELECTRODE BETWEEN ADJACENT SEMICONDUCTOR FINS AND METHOD FOR PRODUCING SUCH A SEMICONDUCTOR COMPONENT
摘要 A semiconductor component includes semiconductor fins formed between a base plane and a main surface of a semiconductor body. Each semiconductor fin includes a source region formed between the main surface and a channel/body region, and a drift zone formed between the channel/body region and the base plane. The semiconductor component further includes gate electrode structures on two mutually opposite sides of each channel/body region, and a field electrode structure between mutually adjacent ones of the semiconductor fins. Each field electrode structure is separated from the drift zone by a field dielectric and extends from the main surface as far as the base plane. The gate electrode structures assigned to the mutually adjacent semiconductor fins enclose an upper portion of the corresponding field electrode structure from two sides.
申请公布号 US2016155809(A1) 申请公布日期 2016.06.02
申请号 US201514953103 申请日期 2015.11.27
申请人 Infineon Technologies Dresden GmbH 发明人 Tegen Stefan;Lemke Marko;Weis Rolf
分类号 H01L29/40;H01L29/78;H01L29/04;H01L29/423;H01L21/306;H01L21/31;H01L21/283;H01L21/311;H01L29/808;H01L29/66 主分类号 H01L29/40
代理机构 代理人
主权项 1. A semiconductor component, comprising: semiconductor fins formed between a base plane and a main surface of a semiconductor body, each semiconductor fin comprising a source region formed between the main surface and a channel/body region and a drift zone formed between the channel/body region and the base plane; gate electrode structures on two mutually opposite sides of each channel/body region; a field electrode structure between mutually adjacent ones of the semiconductor fins, each field electrode structure being separated from the drift zones by a field dielectric and extending from the main surface as far as the base plane, wherein the gate electrode structures assigned to the mutually adjacent semiconductor fins enclose an upper portion of the corresponding field electrode structure from at least two sides; a buried connection layer having a net dopant concentration of at least 1E18 cm−3 between the base plane and a rear-side surface opposite the main surface; and a transistor connection connected to the connection layer and comprising a contact or a highly doped column extending from the main surface as far as the connection layer.
地址 Dresden DE
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