发明名称 |
BONDING METHOD, BONDABILITY IMPROVING AGENT, SURFACE MODIFICATION METHOD, SURFACE MODIFYING AGENT, AND NOVEL COMPOUND |
摘要 |
To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer. |
申请公布号 |
US2016152641(A1) |
申请公布日期 |
2016.06.02 |
申请号 |
US201514954147 |
申请日期 |
2015.11.30 |
申请人 |
MORI Kunio;MATSUNO Yusuke;MORI Katsuhito;KUDO Takahiro |
发明人 |
MORI Kunio;MATSUNO Yusuke;MORI Katsuhito;KUDO Takahiro |
分类号 |
C07F7/08;C08K5/3492;C08K5/544;C07D251/54 |
主分类号 |
C07F7/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Morioka-shi JP |