SHEET-LIKE RESIN COMPOSITION, LAMINATE SHEET, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

摘要

Provided is a sheet-like resin composition with which it is possible to sufficiently suppress voids at the interface of the sheet-like resin composition and an adherend and with which it is possible to suppress excessive protrusion at the time of mounting. Also provided are a laminate sheet that is provided with the sheet-like resin composition, and a semiconductor device production method. The present invention is a heat-curable sheet-like resin composition that is for filling the space between an adherend and a semiconductor element that is electrically connected to the adherend. The sheet-like resin composition has a pre-heat-curing minimum melt viscosity of 2000 Pa⋅s or more at 80°C-200°C and, with regard to measurement by DSC, when the total calorific value of the composition during a temperature increase process from -10°C to 350°C at a temperature increase speed of 10°C/min is Qt and the total calorific value of the composition during a heating process wherein the composition is heated for 10 seconds at 250°C is Qh, the sheet-like resin composition has a reaction rate R, as expressed by the following formula, of 50% or less. R = {(Qt-Qh/Qt)}×100(%).