| 摘要 |
This SAW device comprises: an SAW element; a conductor part that is connected to the SAW element; an LT substrate that comprises the SAW element; and a case that contains the LT substrate comprising the SAW element. The case has a cover part, a lateral part and a bottom part. The bottom part is composed of a sapphire substrate, and the LT substrate is positioned on a first surface of the sapphire substrate, said first surface serving as the inner surface of the case. A second surface of the sapphire substrate, which is on the reverse side of the first surface, serves as the outer surface of the case. The conductor is provided with a via conductor that is positioned within a through hole which continuously penetrates through the sapphire substrate and the LT substrate. |
